- The Turing C256 uncooled infrared module, adopting an advanced 256×192 wafer detector, features compact dimensions, lightweight design, and low power consumption, meeting the SWaP³ design requirements.
- The split assembly makes it more flexible to use.
- It comes with multiple auxiliary development tools that support multiple ARM architecture SOC platforms, ensuring ease of use and integration.
- It also supports the simultaneous output of images and temperature values with a variety of lightweight infrared lenses and extension components. As the best choice for low-cost solutions, this product series can be used in many scenarios such as industry, power, security protection, and machine vision.
File Type: pdf
File Size: 493 KB
Categories: THERMAL MODULE, Turing, Uncooled Long-wave Series
